Follow the installation instructions on the download page to install the update. For deployment information about this update, see security update deployment information: July 11, The English version of this security update has the file attributes or later file attributes that are listed in the following table.
The dates and the times for these files on your local computer are displayed in your local time together with your current daylight-saving time DST bias. Additionally, the dates and the times may change when you perform certain operations on the files. Need more help? Expand your skills. Get new features first. MSL defines moisture absorption into 6 different levels through standard test methods and criteria.
By implementing the right method in packing and handling, damage during the surface-mount solder reflow process can be prevented. This article will provide insight into the appropriate packing and handling methods, including dry-bake before packing, floor life control, and dry-bake for expired floor life non-hermetic packages. The product packing of non-hermetic packages is critical except for those rated MSL 1. This is to prevent moisture absorption of the non-hermetic package.
The packing requirements include some combination of the following, depending on MSL class:. The Dry-Bake process is required to dry off the absorbed moisture in the non-hermetic package before packing.
It has to be performed according to the criteria and conditions in reference to MSL classification and body thickness of the non-hermetic package. Service Management.
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